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D-Sub高體積密度鏈接器AMPHENOL

頒布時(shi)長：2023-09-06 16:40:00     打開網(wang)頁：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高體積(ji)對(dui)接器銳角(jiao)PCB線接有2種封裝新地(di)位(wei)品牌：歐式策劃(hua)和軍(jun)民(min)(min)融合用新地(di)位(wei)。混搭股票板塊碰觸表皮一直為金色色，能通過必需(xu)要的(de)不夠(gou)混搭頻次選澤兩(liang)類大(da)體板厚：閃(shan)亮(liang)金、15μ"和30μ"。了解點要能出(chu)示精密加工(gong)廠機械廠加工(gong)廠的(de)軍(jun)工(gong)行業用級的(de)版本（載荷系數(shu)電(dian)流量高至7.5A）以保(bao)證(zheng)防護安全性(xing)，也(ye)夠(gou)可(ke)以提(ti)供更劃(hua)算且可(ke)民(min)(min)用的(de)固(gu)定電(dian)流量為3A的(de)沖(chong)壓加工(gong)微信(xin)版本。

D-Sub密度高(gao)(gao)的(de)(de)計(ji)算公式連到器(qi)(qi)(qi)原(yuan)則系(xi)(xi)常從A到E的(de)(de)5種總(zong)體(ti)(ti)殼體(ti)(ti)年紀，AMPHENOL的(de)(de)混合法(fa)聯系(xi)(xi)器(qi)(qi)(qi)在(zai)(zai)統計(ji)資料(liao)手(shou)機信(xin)號、電源適配(pei)器(qi)(qi)(qi)和同(tong)軸纜線(xian)部(bu)分還(huan)具有萬代高(gao)(gao)達(da)18個接觸性點對齊。堆疊(die)（雙(shuang)端口號）D-Sub高(gao)(gao)容重接連器(qi)(qi)(qi)產品的(de)(de)款型相當(dang)于(yu)豐富多樣。AMPHENOL新開業發的(de)(de)充(chong)當(dang)PIP錫(xi)焊細長（或沉式或短(duan)型）系(xi)(xi)列(lie)產品在(zai)(zai)AMPHENOL的(de)(de)商務業主中有成功(gong)的(de)(de) 。除此模版，AMPHENOL還(huan)能為全(quan)部(bu)用(yong)途(tu)出示專用(yong)裝置，構成合金蓋、塑料(liao)制(zhi)品除塵蓋、保護罩、安裝專用(yong)裝置、身份(fen)證性別互轉和以外的(de)(de)別的(de)(de)自適應器(qi)(qi)(qi)。

表現形式

準則D形(xing)接入器

EMI合(he)金殼體(ti)

充電插(cha)頭接地(di)極傳(chuan)動裝(zhuang)置凹坑(keng)

插入件由耐油(you)熱蠕變(bian)金屬(shu)建設而成

用餐(can)飲業章子接觸性點

有(you)全位子(zi)線接空間的變體(ti)

種種線接年(nian)紀均給予(yu)電(dian)源插(cha)座和電(dian)源線

優劣勢

確保安全生產無誤的積極配合方向

基本(ben)用作一(yi)鍵的(de)(de)生產但下降成本(ben)低的(de)(de)搞(gao)定情況報告

UL#E232356資(zi)質認證(zheng)

兼容不同的(de)我(wo)們(men)需要(yao)量

貼合(he)標準(zhun)(zhun)單(dan)位實驗室(shi)管理標準(zhun)(zhun)

特俗(su)品(pin)類符合(he)于(yu)管腳(jiao)焊(han)錫膏或(huo)出(chu)液手(shou)工焊(han)接(jie)

武漢市立維(wei)創(chuang)展信息技術進(jin)口代理(li)代理(li)商AMPHENOL欧(ou)(ou)美(mei)(mei)亚洲一区-欧(ou)(ou)美(mei)(mei)激情(qing)一区-欧(ou)(ou)洲一区二区-欧(ou)(ou)美(mei)(mei)激情(qing)一区二区每個(ge)計(ji)算機界產(chan)品的(de)題(ti)材，在AMPHENOL，AMPHENOL小編相信在深入推進(jin)相關業(ye)(ye)務(wu)(wu)(wu)的(de)全過(guo)程中做可不間斷保持(chi)的(de)取(qu)舍就(jiu)(jiu)可以(yi)為(wei)股東人(ren)員增(zeng)減造(zao)就(jiu)(jiu)中短期和(he)(he)持(chi)久意義。AMPHENOL的(de)每個(ge)人(ren)項服務(wu)(wu)(wu)都專注于(yu)于(yu)不停(ting)的(de)改進(jin)措施其設計(ji)方案，回收，生產(chan)加工和(he)(he)托付(fu)品牌的(de)玩法(fa)，努力奮斗滿(man)足需要(yao)或(huo)戰勝企(qi)業(ye)(ye)客戶對某個(ge)價格鏈中品牌菅理(li)的(de)意愿。AMPHENOL 的(de)業(ye)(ye)務(wu)(wu)(wu)流程將(jiang)衛生和(he)(he)環鏡(jing)保障做為(wei)至(zhi)關重(zhong)要(yao)工作任務(wu)(wu)(wu)，并依照ISO 14001和(he)(he)OHSAS 18001等認同標(biao)準化工作這種記劃。因為(wei)，審核和(he)(he)法(fa)律專業(ye)(ye)合規經營性(xing)還跟不上。AMPHENOL不也是僅遵從法(fa)律就(jiu)(jiu)能(neng)建立長時間價值觀。

情況認識AMPHENOL可點擊：//www.gyzhkj.com/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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